TSMC 7nm process for ADAS

Aug 25,2018

Beijing, China (August 18, 2018) -- Maximum-semi announced the launch of automotive grade Design Controller and Map IPT, LPDDR3x, MIP csi-4, e-phy, PCO 4.0 and safety IP in TSMC 7nm process technology to implement advanced automotive design rules to meet the reliability and operational requirements of ADAS and self-driving chips.


Controllers based on 7Nm process technology and Map IPT have a rich product mix, including LPDDR3x, MIP CSI-4, E-PHY, PCO 4.0.


  IPT solutions support advanced vehicle design rules required by TSMC 7Nm process technology to meet reliability and 15-year vehicle operation requirements.


  ISO 26261 ASIL Ready IPT includes security packages, FMEDA reports and security manuals to accelerate chip functional security assessment.

  Suk Lee, Senior Director of TSMC Design Infrastructure Marketing, said: "The years of successful cooperation between TSMC and Meissim have helped common users achieve chip performance, power consumption and area goals. By introducing an automotive-grade design IPT supporting TSMC 7Nm FinFET process technology, Maithsim is committed to providing designers with high-quality IPT, achieving its outstanding design goals and accelerating product launch time.

  John Koets, Vice President of Marketing of Meissim IPT, said: "Developing automobile-grade IPT requires a lot of professional knowledge and rigorous process requirements to ensure that IP meets strict ISO 26261 functional safety standards and AEC-Q100 reliability standards. Meissim will continue to invest heavily in the development of vehicle-grade IPT that supports the most advanced technology such as TSMC 7Nm to help designers improve the functional safety, reliability and automotive quality certification of chips.