TSMC 7nm process for ADAS

Aug 25,2018

Beijing, China (August 18, 2018) -- Maximum-semi announced the launch of automotive grade Design Controller and Map IPT, LPDDR3x, MIP csi-4, e-phy, PCO 4.0 and safety IP in TSMC 7nm process technology to implement advanced automotive design rules to meet the reliability and operational requirements of ADAS and self-driving chips.

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Controllers based on 7Nm process technology and Map IPT have a rich product mix, including LPDDR3x, MIP CSI-4, E-PHY, PCO 4.0.

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  IPT solutions support advanced vehicle design rules required by TSMC 7Nm process technology to meet reliability and 15-year vehicle operation requirements.

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  ISO 26261 ASIL Ready IPT includes security packages, FMEDA reports and security manuals to accelerate chip functional security assessment.


  Suk Lee, Senior Director of TSMC Design Infrastructure Marketing, said: "The years of successful cooperation between TSMC and Meissim have helped common users achieve chip performance, power consumption and area goals. By introducing an automotive-grade design IPT supporting TSMC 7Nm FinFET process technology, Maithsim is committed to providing designers with high-quality IPT, achieving its outstanding design goals and accelerating product launch time.


  John Koets, Vice President of Marketing of Meissim IPT, said: "Developing automobile-grade IPT requires a lot of professional knowledge and rigorous process requirements to ensure that IP meets strict ISO 26261 functional safety standards and AEC-Q100 reliability standards. Meissim will continue to invest heavily in the development of vehicle-grade IPT that supports the most advanced technology such as TSMC 7Nm to help designers improve the functional safety, reliability and automotive quality certification of chips.

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